In the video of AMD’s official celebration of the fifth anniversary of the Ryzen brand in October this year, its technical marketing director Robert Hallock confirmed that AMD will switch to a new platform next year, which will support PCIe 5.0 and DDR5 memory. Obviously this is the Zen 4 architecture processor code-named Raphael, and the new AM5 platform.
As AMD’s next-generation Ryzen processor approaches, the supporting chipset is also in full preparation. For differently positioned processors, AMD’s 600 series chipsets will also be divided into different models, covering the high-end, mid-range, and low-end motherboard markets to meet the needs of different consumers. AMD is currently working with ASMedia, a subsidiary of Asustek, to design a new generation of chipsets.
According to Twitter user @9550pro, the high-end AMD X670 motherboard will have twice the scalability of the B650 chipset. There are also speculations that the X670 chipset may adopt MCM multi-chip packaging, which will contain two B650 chipsets, and achieve such specifications through stack design. For Mini-ITX motherboards, their design and manufacturing will become very difficult. From a financial point of view, this approach can simplify the design of chipset products and reduce costs.
There are rumors that the release time of the Zen 4 architecture processor codenamed Raphael may be at the end of the second quarter or the beginning of the third quarter of 2022. The first to be listed is the motherboard with the X670 chipset, and the B650 motherboard will be about a month later. The new generation of Ryzen processors may be called
Ryzen 7000 series, using a brand-new AM5 socket, using TSMC’s 5nm process manufacturing, IOD is 6nm or 7nm process, integrated RDNA 2 architecture GPU, support PCIe 5.0 and dual-channel DDR5-5200 memory, TDP between 105W-120W, and provide a frequency of about 5GHz. In addition to architecture improvements and performance enhancements, AMD is rumored to further optimize temperature and power management to make it easier to read temperature information and improve power management technology.
