AMD updates RDNA/CDNA architecture roadmap
AMD updated the GPU’s RDNA/CDNA series architecture roadmap at its Financial Analyst Day event. David Wang, senior vice president of engineering and R&D for AMD’s Radeon Technology Group, introduced the next generation of RDNA and CDNA products.
AMD confirmed that the RDNA 3 architecture will use a 5nm process and a small chip design, which will be its first consumer-grade GPU in an MCM multi-chip package, with performance per watt improved by more than 50% compared to the RDNA 2 architecture. The corresponding Navi 3x series GPUs will arrive later this year, and it is not possible to confirm whether the graphics cards appearing in the official slide belong to the Radeon RX 7000 series. Externally, the heatsink design is similar to the existing Radeon RX 6000 series.
AMD said that the RDNA 4 architecture corresponds to the Navi 4x series of GPUs, which will be manufactured with a more advanced process and should be launched in 2024, similar to the CPU’s Zen 5 architecture on the timeline. However, AMD did not reveal too many details about the RDNA 4 architecture this time.
Previous reports have pointed out that the next-generation Instinct MI300 series GPUs used in data centers may be available in a variety of specifications, with HBM3 memory stacks ranging from two to eight, respectively. Products based on the CDNA 3 architecture will use 3D chip stacking technology, and there will be a basic module with an I/O interface under the small chip. Each base module can be connected to two HBM3 memory stacks and is manufactured on a 6nm process, while the compute modules are manufactured on a 5nm process.
The Instinct MI300 series not only appears as a GPU but also as an APU, which encapsulates the modules of the Zen 4 architecture and the CDNA 3 architecture together. The equipped chip will encapsulate the CPU module, the GPU module, and the memory together, which is called the Exascale APU mode.
This time AMD also confirmed some of the above information and confirmed the existence of Exascale APU, but did not disclose specific details, such as the architecture used by the CPU module, and this data center-oriented product will be launched next year.
Via: videocardz
